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BAKU BK-5051 BGA Solder Paste for Mobile Phone Repair 50g Tin 25-45 Microns 63Sn/37Pb

SKU: 06-0270418

Crafted with high-quality 63% tin and 37% lead alloy, this solder paste delivers excellent thermal conductivity and stable melting performance, ensuring durable and reliable solder joints for BGA and SMT applications.
Made with halide-free materials and no harmful additives, this solder paste complies with environmental safety standards. Safe for operators and ideal for electronics repair without corrosion risks.
No-Clean, Low-Residue Efficiency: Minimal post-welding residue eliminates the need for cleaning, saving time and reducing workflow steps. Perfect for high-precision tasks like smartphone and PC motherboard repairs.
25-45m Micro Particles for Precision: Ultra-fine particle size (25-45m) ensures smooth tin loading and even distribution, preventing issues like bridging, tin beads, or cold joints. Ideal for densely packed BGA chips and micro components.
Advanced Membrane Removal Technology: Optimizes efficiency with reduced mesh scraping during application, improving workflow speed. Enhances solder joint brightness, adhesion, and conductivity for professional-grade results.

C$14.01

C$16.12

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Features

1. Crafted with high-quality 63% tin and 37% lead alloy, this solder paste delivers excellent thermal conductivity and stable melting performance, ensuring durable and reliable solder joints for BGA and SMT applications.
2. Made with halide-free materials and no harmful additives, this solder paste complies with environmental safety standards. Safe for operators and ideal for electronics repair without corrosion risks.
3. No-Clean, Low-Residue Efficiency: Minimal post-welding residue eliminates the need for cleaning, saving time and reducing workflow steps. Perfect for high-precision tasks like smartphone and PC motherboard repairs.
4. 25-45m Micro Particles for Precision: Ultra-fine particle size (25-45m) ensures smooth tin loading and even distribution, preventing issues like bridging, tin beads, or cold joints. Ideal for densely packed BGA chips and micro components.
5. Advanced Membrane Removal Technology: Optimizes efficiency with reduced mesh scraping during application, improving workflow speed. Enhances solder joint brightness, adhesion, and conductivity for professional-grade results.

Packing List

BAKU BK-5051 BGA Solder Paste for Mobile Phone Repair 50g Tin 25-45 Microns 63Sn/37Pb
Original set and packaging

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